The BRADLEY DEPARTMENT of ELECTRICAL and COMPUTER ENGINEERING

Mona Ghassemi | ECE | Virginia Tech

ECE PROFILE

Mona Ghassemi

Picture of Mona Ghassemi

Office:
644 Whittemore

Mailing Address:
1185 Perry Street
453 Whittemore (0111)
Virginia Tech
Blacksburg, VA 24061

(540) 231-9928
(540) 231-3362
monag@vt.edu


Teaching Interests:

1-Advanced High Voltage and Electrical Insulation Engineering (ECE 5984): Spring 2018 and 2019, 2-Electric Circuit Analysis (ECE 2004): Fall 2017, 2018, 3-Electromagnetic Transients in Power Systems, 4-Renewable Energy

Research Interests:

High Voltage/Field Technology, Dielectrics and Electrical Insulation Materials and Systems, Multiphysics Modeling, Plasma Science, Electromagnetic Transients in Power Systems, Power System Modeling

Grants and Projects:
  • Office of Naval Research (ONR) "Development of the PEBB 6000 Using Gen3 10 kV, 240 A SiC MOSFET Modules in Full-Bridge Configuration", Co-PI, 12/01/2017-11/30/2021
Selected Publications:
  • Title: Partial discharge measurements, failure analysis and control in high power insulated gate bipolar transistor modules
    Author(s): M. Ghassemi
    Journal: IET High Voltage, Vol. 3, No. 3, pp. 170-178, September, 2018
  • Title: A thermo-electrodynamic electric field dependent molecular ionization model to design electrical insulation system of HVDC wet-mate connectors under transient conditions
    Author(s): M. Ghassemi, Y. Cao, Q. Chen
    Journal: IEEE Trans. on Dielectric and Electrical Insulation, Vol. 25, No. 2, pp. 476-485, April, 2018
  • Title: The influence magnitude and rise time of applied voltage and the type of oil on streamer growth in a wet-mate DC connector
    Author(s): M. Ghassemi, Q. Chen, Y. Cao
    Journal: IEEE Trans. on Dielectric and Electrical Insulation, Vol. 24, No. 3, pp. 1646-1656, June, 2017
  • Title: A thermo-electrodynamic electric field dependent molecular ionization model to realize positive streamer propagation in a wet-mate DC connector
    Author(s): M. Ghassemi, M. B. Tefferi, Q. Chen, Y. Cao
    Journal: IEEE Trans. on Dielectric and Electrical Insulation, Vol. 24, No. 2, pp. 901-914, April, 2017
  • Title: Calculation of minimum approach distances for tools for live working under freezing conditions
    Author(s): M. Ghassemi, M. Farzaneh
    Journal: IEEE Trans. on Dielectric and Electrical Insulation, Vol. 23, No. 2, pp. 987-994, April, 2016
  • Title: Effects of tower, phase conductors and shield wires on electrical field around FRP hot stick during live-line work
    Author(s): M. Ghassemi, M. Farzaneh
    Journal: IEEE Trans. on Dielectric and Electrical Insulation, Vol. 22, No. 6, pp. 3413-3420, December, 2015
  • Title: Coupled computational fluid dynamics and heat transfer modeling of the effects of wind speed and direction on temperature increase of an ice-covered FRP live-line tool
    Author(s): M. Ghassemi, M. Farzaneh
    Journal: IEEE Trans. on Power Delivery, Vol. 30, No. 5, pp. 2268-2275, October, 2015
  • Title: A coupled computational fluid dynamics and heat transfer model for accurate estimation of temperature increase of an ice-covered FRP live-line tool
    Author(s): M. Ghassemi, M. Farzaneh, W. A. Chisholm
    Journal: IEEE Trans. on Dielectric and Electrical Insulation, Vol. 21, No. 6, pp. 2628-2633, December, 2014
  • Title: Three-dimensional FEM electrical field calculation for FRP hot stick during EHV live-line work
    Author(s): M. Ghassemi, M. Farzaneh, W. A. Chisholm
    Journal: IEEE Trans. on Dielectric and Electrical Insulation, Vol. 21, No. 6, pp. 2531-2540, December, 2014
  • Title: A detailed model for discharge initiating in argon at atmospheric pressure in presence of dielectrics barriers
    Author(s): M. Ghassemi, H. Mohseni, K. Niayesh, A. A. Shayegani
    Journal: IEEE Trans. on Dielectric and Electrical Insulation, Vol. 19, No. 3, pp. 865-876, June, 2012
  • Book Chapter: Mona Ghassemi (October 17th 2018), "Electrical Insulation Weaknesses in Wide Bandgap Devices," Simulation and Modelling of Electrical Insulation Weaknesses in Electrical Equipment (Ed. R.A. Sanchez), IntechOpen, DOI: 10.5772/intechopen.77657.