This two-course sequence covers principles and analyses for design and manufacture of electronic packages. 4235: design issues such as electrical, electromagnetic, thermal, mechanical, and thermomechanical, are covered at the lower levels of packaging hierarchy. Materials and process selection guidelines are discussed for the manufacturing and reliability of chip carriers, multichip and hybrid modules. 4236: system-level package design issues for meeting application requirements and modeling tools for analyzing electronic packages are introduced. Materials and process selection guidelines are discussed for the manufacturing and reliability of packaged electronic products.
Demands for high performance and high integration of functions in electronic products have made the interconnection and protection of circuits critical to the overall system performance, reliability, and cost. A multidisciplinary electronic packaging team is necessary to develop a competitive product. The aim of this course is to better prepare students for the electronics industry by teaching them the principles of electronic packaging, such as how thermal, mechanical, electrical, and materials issues are taken into consideration for packaging a complex electronic system. This course also serves as an introduction to the subject for electrical and materials graduate students who have had no previous exposure to the subject.
Percentage of Course
|Introduction to Microelectronics and Electronic Packaging||10%|
|Electrical and Electromagnetic Design Issues||15%|
|Thermal and Thermomechanical Design Issues||10%|
|Designs, Materials, and Processes for Ceramic Chip Carriers, Multichip and Hybrid Modules||15%|
|Designs, Materials, and Processes for Plastic Packages||15%|
|Printed-wiring Board (PWB) Designs, Materials and Processes||10%|
|Chip to Package Interconnections||10%|
|Package Reliability, Testing, and Failure analysis||15%|