Electrical and thermal design of electronics packaging using finite element analysis software. Materials and process selection guidelines for the fabrication of single- and multi-chip electronics packages. Methods for characterization and testing of electronics packages. Failure mechanisms and design for reliability. Hands-on project experience on electronics packaging.
Electronics packaging is rapidly advancing due to increased market demand in many application areas, including portable and consumer electronics, electric and hybrid-electric transportation, datacenters, and renewable energy. Moreover, technology and business trends lead to increased design complexity, longer product lifetimes, greater ruggedness and reliability requirements, and challenges in assembly manufacturing. A multidisciplinary packaging team is necessary to overcome these increasing demands. The aim of this course is to better prepare students for the electronics industry by teaching them the principles of packaging. Students will learn about the key electrical, thermal, materials, and reliability challenges, trade-offs, and state-of-the-art solutions. With this transdisciplinary knowledge, students will have the foundation needed to design suitable packaging for todayís electronics.
Percentage of Course
|Introduction to electronics packaging||5%|
|Materials and processes a. Substrate b. Die attach c. Interconnects d. Encapsulation e. Terminals||25%|
|Characterization and testing methods||15%|