The BRADLEY DEPARTMENT of ELECTRICAL and COMPUTER ENGINEERING

ECE 4254 Principles of Electronics Packaging | ECE | Virginia Tech

Undergraduate PROGRAMS

Course Information

Description

Electrical and thermal design of electronics packaging using finite element analysis software. Materials and process selection guidelines for the fabrication of single- and multi-chip electronics packages. Methods for characterization and testing of electronics packages. Failure mechanisms and design for reliability. Hands-on project experience on electronics packaging.

Why take this course?

Electronics packaging is rapidly advancing due to increased market demand in many application areas, including portable and consumer electronics, electric and hybrid-electric transportation, datacenters, and renewable energy. Moreover, technology and business trends lead to increased design complexity, longer product lifetimes, greater ruggedness and reliability requirements, and challenges in assembly manufacturing. A multidisciplinary packaging team is necessary to overcome these increasing demands. The aim of this course is to better prepare students for the electronics industry by teaching them the principles of packaging. Students will learn about the key electrical, thermal, materials, and reliability challenges, trade-offs, and state-of-the-art solutions. With this transdisciplinary knowledge, students will have the foundation needed to design suitable packaging for todayís electronics.

Learning Objectives

  • 1. Design basic architecture and layout of an electronics package;
  • 2. Analyze the electrical and thermal characteristics of an electronics package
  • 3. Select appropriate materials and processes for the fabrication of an electronics package;
  • 4. Choose appropriate characterization and testing methods for electronics packages;
  • 5. Determine failure mechanisms and reliability for an electronics package.

Course Topics

Topic

Percentage of Course

Introduction to electronics packaging 5%
Electrical design 20%
Thermal design 20%
Materials and processes a. Substrate b. Die attach c. Interconnects d. Encapsulation e. Terminals 25%
Characterization and testing methods 15%
Reliability 10%
Emerging technologies 5%